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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
32 Freescale Semiconductor
Package Description
8.4 Mechanical Dimensions for the MPC7448, 360 HCTE LGA
Figure 13 provides the mechanical dimensions and bottom surface nomenclature for the MPC7448, 360
HCTE LGA package.
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7448,
360 HCTE LGA Package
NOTES:
1. Dimensioning and
tolerancing per ASME
Y14.5M, 1994
2. Dimensions in millimeters
3. Top side A1 corner index is a
metalized feature with
various shapes. Bottom side
A1 corner is designated with
a pad missing from the array.
0.2
C
A
360X
D
2X
A1 CORNER
E
e
0.2
2X
C
B
12345678910111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B0.3
A
0.15
b
A
0.15 A
171819
U
W
V
Millimeters
Dim Min Max
A 1.52 1.80
A1 0.70 0.90
A2 0.6
b 0.82 0.93
D 25.00 BSC
D1 11.3
D2 8.0
D3 6.5
D4 7.2 7.4
e 1.27 BSC
E 25.00 BSC
E1 11.3
E2 8.0
E3 6.5
E4 7.9 8.1
Capacitor Region
1
D3
E2
E1
A
A1
A2
E4
D4
E3
D1
D2
0.35 A
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