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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor 13
Electrical and Thermal Characteristics
Table 7 provides the power consumption for the MPC7448 part numbers described by this document; see
Section 11.1, “Part Numbers Fully Addressed by This Document,” for information regarding which part
numbers are described by this document. Freescale also offers MPC7448 part numbers that meet lower
power consumption specifications by adhering to lower core voltage and core frequency specifications.
For more information on these devices, including references to the MPC7448 Hardware Specification
Addenda that describe these devices, see Section 11.2, “Part Numbers Not Fully Addressed by This
Document.”
The power consumptions provided in Table 7 represent the power consumption of each speed grade when
operated at the rated maximum core frequency (see Table 8). Freescale sorts devices by power as well as
by core frequency, and power limits for each speed grade are independent of each other. Each device is
tested at its maximum core frequency only. (Note that Deep Sleep Mode power consumption is
independent of clock frequency.) Operating a device at a frequency lower than its rated maximum is fully
supported provided the clock frequencies are within the specifications given in Table 8, and a device
operated below its rated maximum will have lower power consumption. However, inferences should not
be made about a device’s power consumption based on the power specifications of another (lower) speed
grade. For example, a 1700 MHz device operated at 1420 MHz may not exhibit the same power
consumption as a 1420 MHz device operated at 1420 MHz.
For all MPC7448 devices, the following guidelines on the use of these parameters for system design are
suggested. The Full-Power Mode–Typical value represents the sustained power consumption of the device
High-impedance (off-state) leakage current:
V
in
= OV
DD
V
in
= GND
—I
TSI
—
50
– 50
µA 2, 3, 4
Output high voltage @ I
OH
= –5 mA 1.5 V
OH
OV
DD
– 0.45 — V
1.8 OV
DD
– 0.45 —
2.5 1.8 —
Output low voltage @ I
OL
=
5 mA 1.5 V
OL
—0.45V
1.8 — 0.45
2.5 — 0.6
Capacitance,
V
in
=
0 V, f = 1 MHz
All inputs C
in
—8.0pF5
Notes:
1. Nominal voltages; see Ta bl e 4 for recommended operating conditions.
2. All I/O signals are referenced to OV
DD
.
3. Excludes test signals and IEEE Std. 1149.1 boundary scan (JTAG) signals
4. The leakage is measured for nominal OV
DD
and V
DD
, or both OV
DD
and V
DD
must vary in the same direction (for
example, both OV
DD
and V
DD
vary by either +5% or –5%).
5. Capacitance is periodically sampled rather than 100% tested.
6. These pins have internal pull-up resistors.
Table 6. DC Electrical Specifications (continued)
At recommended operating conditions. See Table 4.
Characteristic
Nominal Bus
Voltage
1
Symbol Min Max Unit Notes
- RISC Microprocessor 1
- Hardware Specifications 1
- 2 Freescale Semiconductor 2
- 2Features 3
- 4 Freescale Semiconductor 4
- Freescale Semiconductor 5 5
- 6 Freescale Semiconductor 6
- 4 General Parameters 9
- 5.2.1 Clock AC Specifications 15
- Figure 5 17
- (continued) 18
- Figure 4. AC Test Load 19
- Figure 11 21
- Figure 9. TRST Timing Diagram 22
- 6 Pin Assignments 24
- 7 Pinout Listings 25
- Pinout Listings 26
- 8 Package Description 29
- HCTE BGA package 30
- Freescale Semiconductor 31 31
- HCTE LGA package 32
- RoHS-Compliant BGA 33
- 9 System Design Information 35
- System Design Information 36
- 9.2.1 Power Supply Sequencing 37
- Freescale Semiconductor 41 41
- Freescale Semiconductor 43 43
- 44 Freescale Semiconductor 44
- 50 Freescale Semiconductor 50
- 52 Freescale Semiconductor 52
- = (P– P 53
- 10 Document Revision History 55
- Document Revision History 56
- 11 Part Numbering and Marking 57
- Part Numbering and Marking 58
- 11.3 Part Marking 59
- How to Reach Us: 60
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