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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor 31

Package Description

8.3 Package Parameters for the MPC7448, 360 HCTE LGA

The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360 pin

high coefficient of thermal expansion ceramic land grid array (HCTE).

Package outline 25 × 25 mm

Interconnects 360 (19 × 19 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height 1.52 mm

Maximum module height 1.80 mm

Pad diameter 0.89 mm (35 mil)

Coefficient of thermal expansion12.3 ppm/°C

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Compatible Systems RISC 2800i Manuale Utente Pagina 31