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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

30 Freescale Semiconductor

Package Description

8.2 Mechanical Dimensions for the MPC7448, 360 HCTE BGA

Figure 13 provides the mechanical dimensions and bottom surface nomenclature for the MPC7448, 360

HCTE BGA package.

Figure 13. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7448,

360 HCTE BGA Package

NOTES:

1. Dimensioning and

tolerancing per ASME

Y14.5M, 1994

2. Dimensions in millimeters.

3. Top side A1 corner index is a

metalized feature with

various shapes. Bottom side

A1 corner is designated with

a ball missing from the array.

0.2

360X

A1 CORNER

0.2

12345678910111213141516

B0.3

0.15

0.15 A

171819

Millimeters

Dim Min Max

A 2.32 2.80

A1 0.80 1.00

A2 0.70 0.90

A3 — 0.6

b 0.82 0.93

D 25.00 BSC

D1 — 11.3

D2 8.0 —

D3 — 6.5

D4 7.2 7.4

e 1.27 BSC

E 25.00 BSC

E1 — 11.3

E2 8.0 —

E3 — 6.5

E4 7.9 8.1

Capacitor Region

0.35 A

1 2 ... 25 26 27 28 29 30 31 32 33 34 35 ... 59 60

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